Bonding Quality of Copper-Nickel Fine Clad Metal Prepared by Surface Activated Bonding
نویسندگان
چکیده
منابع مشابه
Next Generation Nickel-Based Bond Pads Enable Copper Wire Bonding
Copper wire bonding has huge cost advantages over gold wire bonding. As a result, low pin count, heavy wire applications have already been converted to copper wire and many companies are in high volume production. Recently, with the price of gold skyrocketing, conversion of high pin count (>250 I/O), high performance applications to Cu has dramatically accelerated. These high performance device...
متن کاملNickel-palladium bond pads for copper wire bonding
Please cite this article in press as: Clauberg H j.microrel.2010.05.001 The semiconductor packaging industry is undergoing a step-change transition from gold to copper wire bonding brought on by a quadrupling of gold cost over the last 8 years. The transition has been exceptionally rapid over the last 3 years and virtually all companies in the industry now have significant copper wire bonding p...
متن کاملSurface activated bonding of copper through silicon vias and gold stud bumps at room temperature
A comprehensive investigation of the surfaces of copper through silicon vias Cu-TSVs and gold stud bumps is presented. These vias and stud bumps were bonded at room temperature using a nanobonding and interconnection equipment. The influence of heating on the bonded interface was also studied. In order to achieve an intimate contact between the Au-stud bumps and Cu-TSVs, the stud bumps were fla...
متن کاملWire bonding using copper wire
Purpose – This paper attempts to review recent advances in wire bonding using copper wire. Design/methodology/approach – Dozens of journal and conference articles published recently are reviewed. Findings – The problems/challenges such as wire open and short tail defects, poor bondability for stitch/wedge bonds, oxidation of Cu wire, strainhardening effects, and stiff wire on weak support struc...
متن کاملWafer Level Surface Activated Bonding Tool for MEMS Packaging
A wafer level surface activated bonding ~SAB! tool has been developed for microelectromechanical systems ~MEMS! packaging at low temperature. The tool accommodates 8 in. diam wafers. The principle features of the tool are the automatic parallel adjustment for 8 in. wafers to a margin of error within 61 mm and the X, Y, and u axis alignments with an accuracy of 60.5 mm. We have approached a new ...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: MATERIALS TRANSACTIONS
سال: 2010
ISSN: 1345-9678,1347-5320
DOI: 10.2320/matertrans.m2009354